Sonyhybridbonding

由 Y Kagawa 著作 · 被引用 35 次 — Hybrid bonding is a method that connects two substrates by Cu-Cu metal bonding and by inter layer dielectric (ILD)-. ILD oxide bonding at the same time [2]. The ...

2022年7月21日 — Wafer-to-wafer (W2W) hybrid bonding, which involves stacking the wafers face-to-face, bonding, annealing, and then singulating the stack, has a ...

2020年10月1日 — Hybrid bonding went into volume production after Sony licensed the Zibond technology from Ziptronix (now part of Xperi) and introduced it ...

... hybrid bonding technology and discussed what's to come in 2023 and beyond ... Sony, that bond pitches as small as 2.2 µm are common, and the trend points ...

“We believe it demonstrates that our patented hybrid bonding technology is both enabling and cost effective as compared to stacking with TSVs. We expect this ...

2021年5月23日 — There is one aspect apart from this being a SWIR sensor: Cu-Cu hybrid die to wafer bonding of 2 components of completely different process ...

Cu-Cu hybrid bonding is one of the flip chip assembly technologies. View.

由 Y Kagawa 著作 · 2023 — Abstract—We have developed the novel structure of Cu-Cu hybrid bonding called “Cu-Cu wiring”. The Cu-Cu wirings have been formed through hybrid bonding of ...

2022年7月29日 — 因此有學者提出利用銅─銅混合鍵合（Cu-Cu Hybrid Bonding）技術，將金屬接點鑲嵌在介電材料（Dielectric Material）之間，並同時利用熱處理接合兩種材料 ...